Mitre Bonding Adhesive System 50g + 200ml

Product Ref: SMF100

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£3.39 ex. VAT £4.07 inc. VATRRP: £0.00
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Product Description

Soudal Mitre Bonding Adhesive System 50g + 200ml

Soudal Mitre Bonding Adhesive System Kit it a two part instant adhesive system comprising a cynanocrylate adhesive and aerosol activator.

Mitre Kit is a fast ascting cyanoacrylate based adhesive with activator which is particularly useful for production lines and UPVC window trim bonding.

  • Activator reduces blooming
  • Activator reduces odour
  • Fast acting
  • Curing will occur almost instantly
  • Easy to use

Mitre Kit is mainly used in the furniture, timber, kitchen and plastics industry where its instant bonding properties dramatically reduce assembly times for mitre joints when compared to conventional wood adhesives. The product is also suitable for instant bonding of MDF, rubber, PVCU, metals and most plastics.

 

Technical Detail

 

CHARACTERISTICS / ADVANTAGES

Flash setting formulation - bonds most surfaces within 10 seconds, cutting down dramatically mitre assembly bonding times when compared to conventional wood adhesives.

▪ High viscosity adhesive – low soak in to give greater bond strength than conventional cyanoacrylates on porous surfaces (eg wood)

▪ Gap filling – high viscosity adhesive will fill small gaps in mitres etc (up to 0.2mm)

▪ Economical in use.

 

Mitre Fast Activator

Chemical Base: Hydrocarbon solvent

Appearance: Colourless

 

Mitre Fast Adhesive

Solids:100 %

Thermal conductivity: 0.2 w/k.m

Gap filling: up to 0.2 mm

Refractive index: 1.45 (cured)

Dielectric strength: 11-13 kV/mm

Dielectric constant: 5.2 @ 1MHz 9Cured)

Softening point: 165 ºC

 

CHARACTERISTICS / ADVANTAGES

Flash setting formulation - bonds most surfaces within 10 seconds, cutting down dramatically mitre assembly bonding times when compared to conventional wood adhesives.

▪ High viscosity adhesive – low soak in to give greater bond strength than conventional cyanoacrylates on porous surfaces (eg wood)

▪ Gap filling – high viscosity adhesive will fill small gaps in mitres etc (up to 0.2mm)

▪ Economical in use.

 

Mitre Fast Activator

Chemical Base: Hydrocarbon solvent

Appearance: Colourless

 

Mitre Fast Adhesive

Solids:100 %

Thermal conductivity: 0.2 w/k.m

Gap filling: up to 0.2 mm

Refractive index: 1.45 (cured)

Dielectric strength: 11-13 kV/mm

Dielectric constant: 5.2 @ 1MHz 9Cured)

Softening point: 165 ºC

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